• A non-odorous, low surface tension, one component epoxy resin designed as a one-step underfill for flip chip, CSP, BGA and uBGA assemblies. Available in industry standard sizes.

• Excellent Capillary Function for Fast Reflow Compatible with No-Clean Flux Residues Odorless During Printing and Curing Flux Action to Make Solder Connections Non-Hygroscopic Reworkable Good Storage Properties No Voiding Cures in Lead-Free Profile .